DIP Services
The DIP (Dual In-line Package) process is a traditional method used in PCB (Printed Circuit Board) assembly for placing components that have dual rows of pins. Here's an overview of how Our DIP process works in PCB assembly (PCBA) production.
Component Insertion
In the DIP process, components with dual in-line packages are manually or automatically inserted into the PCB's pre-drilled holes. Each component has two rows of pins that align with the holes on the board.
Securing the Components
After insertion, the components are held in place by the PCB's through-holes. For manual assembly, operators physically push the components into the holes. For automated processes, machines or robots handle the insertion.
We are offering both, but specially we focus on Automation Plug In.
Soldering
The PCB then goes through a soldering process to secure the components. There are two common methods
- Wave Soldering: The entire PCB is passed over a wave of molten solder, which flows through the holes and creates solder joints around the component pins.
- Hand Soldering: For smaller batches or more complex boards, soldering can be done manually using a soldering iron. This method is time-consuming but allows for precise work.
We Provide Latest Wave Soldering Method to make sure the quality control and long lasting of our products.
Inspection and Testing
After soldering, the PCB is inspected to ensure that all components are properly soldered and no solder bridges or defects are present. This inspection is typically done using visual inspection or automated optical inspection (AOI) systems.
Rework and Repair
Any issues found during inspection are addressed through rework. This involves correcting soldering errors or replacing faulty components.
Final Assembly
Once the PCB passes inspection, it may undergo additional assembly steps, such as attaching connectors or integrating it into a final product.
Spray
After DIP Plugin Process, our products pass through our latest Automatic Flux Spray Process which make our products ready to ship and protects the moisture during sea shipments.
Packaging
The finished PCBs are packaged and prepared for shipping to customers or for further integration into final products.
DIP Process
The DIP process is valued for its robustness and simplicity, especially for components that are larger or have higher pin counts. However, it is less common in modern electronics, where surface-mount technology (SMT) is often preferred for its ability to support higher component densities and more compact designs.